Molded Interconnect Devices in Japan

Three-Dimensional Molded Interconnect Devices (3D-MID)

An Integrated Design System for Molded Interconnect Devices (3d-mid)

In this paper, MIDCAD, an integrated design system for Molded Interconnect Devices, is presented and some important techniques for the development of this design system are discussed. A series of MID-related special functions and an integrated MID product model, which are not supported by conventional MCAD und ECAD systems, were developed in MIDCAD. Based on the product model, the simulation of...

Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application

The current contribution reports about the fabrication technology for the development of novel microfluidic impedance spectroscopy sensors that are directly attachable on 3-D molded interconnect devices (3DMID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications. Advantages of the MID technology in particular for an automotive industry application were recen...

A Multilayer Process for 3D-Molded-Interconnect-Devices to Enable the Assembly of Area-Array Based Package Types

Three-dimensional molded interconnected devices (3D-MID) extend the range of classical printed circuit boards (PCB) to the third dimension. Electrical circuits can be routed over any surface forms. This enables innovative applications and new design possibilities. The combination of circuit carrier, housing, and further functions results in an increased density of integration with decreased pro...

Benchmarking Methodology for Network Interconnect Devices

This document discusses and defines a number of tests that may be used to describe the performance characteristics of a network interconnecting device. In addition to defining the tests this document also describes specific formats for reporting the results of the tests. Appendix A lists the tests and conditions that we believe should be included for specific cases and gives additional informat...